Delta's digital twin technology powers industrial innovation
Delta showcased its DIATwin Virtual Machine Development Platform at the two events. DIATwin offers virtual machine construction, offline process planning, and virtual machine commissioning. Integrating AI, the platform uses a high-fidelity physics engine and a comprehensive component database, enabling rapid testing of machine designs and process parameters in virtual models. This can speed up new product introduction by around 20%. At the 2024 Automation Taipei and SEMICON Taiwan shows, DIATwin stood at the center of attention with its cyber-physical demo.

DIATwin has been successfully applied in precision circuit board assembly processes, helping major electronics assembly manufacturers speed up their new product introductions. Through software simulation and computing, DIATwin optimizes the glue dispensing paths of robotic arms, reducing machine commissioning time by over 80%. For semiconductor manufacturing wafer inspection, DIATwin accurately simulates the loading and unloading points and paths of the wafer by importing the 3D model of Delta’s Wafer Edge Profile Measurement Machine. DIATwin enables evaluation of production cycles and significantly reduces the trial-and-error costs of new product introductions.

(Left) During the media tour, Joe Wu, Deputy BG Head of Industrial Automation introduces Delta’s Smart Manufacturing Solutions, DIATwin, Smart Warehousing and Logistics Solutions. (Right) At SEMICON Taiwan 2024, Delta showcased the Wafer Edge Profile Measurement Machine with DIATwin digital twin technology to demonstrate cyber-physical process simulation.

Meeting the diverse needs of semiconductor production lines
Delta introduced cutting-edge equipment for semiconductor manufacturing, addressing both front-end and back-end production challenges. For front-end IC production, Delta's Wafer Edge Profile Measurement Solution uses advanced optical technology to perform non-contact inspections. This system checks wafers for defects with micro-level precision, inspecting 60 to 120 wafers per hour. It also supports automated robotic handling and AGV (automated guided vehicle) transport, integrating multiple functions into one machine. Such features reduce the need to switch between machines during the manufacturing process, greatly increasing efficiency and the overall value of the equipment.

The biggest challenge in IC packaging is managing the material feeding and precise placement of various chips and components, each of which demands specialized equipment. This drives up investment costs and complicates processes and space allocation. UI’s High-Speed Multi-Die Advanced Packaging equipment is equipped with the FuzionSC™ high-precision platform and a High-Speed Wafer Feeder, achieving speeds three times faster than the industry standard with placement repeatability within 3 micrometers. The FuzionSC Platform enables semiconductor manufacturers to place passive components and a full range of die on diverse substrates and carriers using a single equipment platform, flexibly addressing the diverse demands of production lines.

Driving smart manufacturing across industries
Beyond advanced semiconductor equipment and solutions, Delta leverages years of expertise in industrial control to deliver integrated smart manufacturing solutions, accelerating digital transformation in precision processes. At Taipei Automation, Delta responded to the e-commerce boom with an intelligent warehousing and logistics solution, combining 3D machine vision and wireless charging to boost AGV efficiency. Further integrating Delta’s warehouse management system optimizes labor and cuts logistics costs by up to 30%.

Delta’s innovative High-Speed Die Pick-and-Place Solution, powered by the Linear Pocket Actuator LPL Series, achieves faster, more precise die handling—reducing cycle time by 15% and increasing yields by 20%. At the expo, Delta’s linear actuator demo impressed visitors with its smooth control, which highlighted Delta’s prowess in precision motion control technology.

(Left) Delta's High-Speed Die Pick-and-Place Solution, featuring its advanced motion control, drew in attendees at the Automation Expo for detailed demonstrations. (Right) At SEMICON Taiwan 2024, Delta's High-Speed Multi-Die Advanced Packaging equipment achieves placement repeatability within 3 micrometers, addressing diverse production needs.

During Taipei Automation, Delta hosted multiple seminars covering topics such as digital twin technology, smart factories, equipment connectivity, electronic assembly press-fit solutions, and green factory transformations. These comprehensive solutions addressed a wide range of needs, from equipment and production lines to plant management. At SEMICON Taiwan, Glenn Farris, VP of Global Equipment Sales Operations and Marketing, was invited to speak at the Expert Talk event, where he shared insights on market trends, the latest in advanced packaging technology, and how Delta's integrated hardware and software solutions enhance equipment utilization. The audience engaged in lively discussions, particularly around the latest High Bandwidth Memory (HBM) technology.

With the successful conclusion of the exhibitions, Delta is poised to continue driving innovation by leveraging digital twin and AI technologies to equip the semiconductor industry with state-of-the-art solutions and precision processes, empowering industry partners to lead the next wave of smart manufacturing.

(Left) During the Automation Expo, Delta hosted several seminars. The photo shows an NVIDIA expert sharing how the Omniverse platform enables DIATwin's cyber-physical integration. (Right) At the Smart Manufacturing Expert Talk of SEMICON Taiwan 2024, Glenn Farris, VP of Global Equipment Sales Operations and Marketing at Universal Instruments, shared insights on advanced packaging.